Lasertec Inc

Qingdao, Shandong 266107

COMPANY OVERVIEW

About Lasertec Inc

80

Contact

177 CongYang Rd
ChengYang
Qingdao, Shandong 266107
China
http://www.lcoptical.com
86-532-6895-9242
86-186-6986-9308

More Info on Lasertec Inc

Manufactures precision optical components and laser crystals, including precision optics, laser mirrors,Focus Lenses, Optical etalon, laser polarizers, laser crystals as NdYAG,NdYVO4, NLO crystals as KTP,LBO,BBO, for laser systems.

Products

Buyer's Guide

Infrared Filter

We provide IR Bandpass Filter, IR Shortpass Filter (SP), Longpass Filter (LP)] which can be used IR Thermal Imaging & Thermal Sensing, IR Thermography at competitive prices
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Infrared windows

Lasertec offers different IR material of precision windows.These IR materials include Ge, Si, CaF2, MgF2, ZnS, ZnSe. The windows are applied into thermal imaging system.
Shared User Pr2410ff141b7c42ecb411ebbf1c213931
Shared User Pr2410ff141b7c42ecb411ebbf1c213931
Shared User Pr2410ff141b7c42ecb411ebbf1c213931
Shared User Pr2410ff141b7c42ecb411ebbf1c213931
Shared User Pr2410ff141b7c42ecb411ebbf1c213931
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Filter

The filters are manufacture with Veeco's spector and leybold's APS1104 coaters. The coating is characteringed by its high adheresion,high stabilyty and low absorption
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Prism

Lasertec provides many kinds of high precision prisms, including Penta Prism, Beamsplitter Penta Prism, Right Angle Prism, and Corner Cube.
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Lens

Plano-Convex Lens is best used where one conjugate point (object distance S or image distance S') is more than five times the other.
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high quality lens

Lens with AR coating with 65MW/cm2 CWlaser with IBS coating
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Diffusion bonding YAG rod

Impress quality for YAG with optical contact bonding technology
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LBO crystal

LBO-with low absorption and high damaged threshold coating by IAD
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Thin Film Polarizer

high damaged threshold and high extinction rate with IBS coating
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NdYVO4 crystal

0.27%NdYVO4 with Low absorption and ultra low reflectivity at 1064nm

Articles

Ultraviolet (excimer) lasers are used to simultaneously drill holes in human hair by means of the mask technique.
Ultraviolet (excimer) lasers are used to simultaneously drill holes in human hair by means of the mask technique.
Ultraviolet (excimer) lasers are used to simultaneously drill holes in human hair by means of the mask technique.
Ultraviolet (excimer) lasers are used to simultaneously drill holes in human hair by means of the mask technique.
Ultraviolet (excimer) lasers are used to simultaneously drill holes in human hair by means of the mask technique.
Industrial Laser Solutions

Understanding ultraviolet lasers

UV lasers are well suited for applications on a micro scale with high-quality results.
(Photo courtesy of Lasertec USA)
FIGURE 1. Confocal image contains a measurement of a 0.273-µm photoresist line on a silicon wafer taken at a 5600X magnification, equivalent to the resolution of a scanning electron microscope. The profile overlay is taken along the horizontal solid line. The width is measured at a 50% slice level, meaning that the measurement is made at the halfway point between the bottom and top of the resist line. This slice level can be adjusted between 5% and 95%, so the width can be measured at any elevation on the side wall that is required. The height of the photoresist line is 0.29 µm. The height, as well as the width, can be rapidly measured to a precision of 0.001 µm. The repeatability of measurement in the horizontal and vertical direction is 0.02 µm.
FIGURE 1. Confocal image contains a measurement of a 0.273-µm photoresist line on a silicon wafer taken at a 5600X magnification, equivalent to the resolution of a scanning electron microscope. The profile overlay is taken along the horizontal solid line. The width is measured at a 50% slice level, meaning that the measurement is made at the halfway point between the bottom and top of the resist line. This slice level can be adjusted between 5% and 95%, so the width can be measured at any elevation on the side wall that is required. The height of the photoresist line is 0.29 µm. The height, as well as the width, can be rapidly measured to a precision of 0.001 µm. The repeatability of measurement in the horizontal and vertical direction is 0.02 µm.
FIGURE 1. Confocal image contains a measurement of a 0.273-µm photoresist line on a silicon wafer taken at a 5600X magnification, equivalent to the resolution of a scanning electron microscope. The profile overlay is taken along the horizontal solid line. The width is measured at a 50% slice level, meaning that the measurement is made at the halfway point between the bottom and top of the resist line. This slice level can be adjusted between 5% and 95%, so the width can be measured at any elevation on the side wall that is required. The height of the photoresist line is 0.29 µm. The height, as well as the width, can be rapidly measured to a precision of 0.001 µm. The repeatability of measurement in the horizontal and vertical direction is 0.02 µm.
FIGURE 1. Confocal image contains a measurement of a 0.273-µm photoresist line on a silicon wafer taken at a 5600X magnification, equivalent to the resolution of a scanning electron microscope. The profile overlay is taken along the horizontal solid line. The width is measured at a 50% slice level, meaning that the measurement is made at the halfway point between the bottom and top of the resist line. This slice level can be adjusted between 5% and 95%, so the width can be measured at any elevation on the side wall that is required. The height of the photoresist line is 0.29 µm. The height, as well as the width, can be rapidly measured to a precision of 0.001 µm. The repeatability of measurement in the horizontal and vertical direction is 0.02 µm.
FIGURE 1. Confocal image contains a measurement of a 0.273-µm photoresist line on a silicon wafer taken at a 5600X magnification, equivalent to the resolution of a scanning electron microscope. The profile overlay is taken along the horizontal solid line. The width is measured at a 50% slice level, meaning that the measurement is made at the halfway point between the bottom and top of the resist line. This slice level can be adjusted between 5% and 95%, so the width can be measured at any elevation on the side wall that is required. The height of the photoresist line is 0.29 µm. The height, as well as the width, can be rapidly measured to a precision of 0.001 µm. The repeatability of measurement in the horizontal and vertical direction is 0.02 µm.
Test & Measurement

Blue-emitting diode laser aids confocal microscopy

Used as the light source for a confocal laser scanning microscope, a 410-nm-emitting diode laser boosts image resolution to that of a scanning electron microscope.

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